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Feature Summary CD2-BEBOP
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Form Factor
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Double size CompactPCI style Eurocard (160x233mm2),
front panel width 4HP (20.3mm)
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Processor
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Designed for Intel® Pentium® M Micro FC-BGA 479 processors
(0.13µ Banias, 0.09µ Dothan), maximum junction temperature 100°C
- 600MHz ULV Celeron® M, 512KB L2 cache, 7W
- 1.4GHz LV Pentium® M (Dothan733), 2MB L2 cache, 10W
- 1.8GHz Pentium® M (Dothan745), 2MB L2 cache, 21W
- 2.0GHz Pentium® M (Dothan755), 2MB L2 cache, 21W
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Chipset
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Intel® i855 chipset consisting of:
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82855GME Graphics/Memory Controller Hub (GMCH) - Montara
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82801D I/O Controller Hub (ICH4)
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2 x Firmware Hub (FWH) 82802 compatible
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Memory
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200-pin SO-DIMM socket (notebook style module), PC2100/2700 DDR266/333-SDRAM,
1GB maximum
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Video
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Analog monitor and digital flat-panel display support by DVI-I connector
(front panel), up to 2048x1536 pixel 16M colours @75Hz refresh rate (analog),
up to 1600 x 1200 pixel 16M colours @60Hz (digital), incorporates
PanelLink Digital technology (Silicon Image). Front panel option: D-Sub
(female HD15) VGA connector available, replaces DVI-I connector
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USB
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All ports over-current protected, data transfer rate of up to 480Mbps, conforming to USB2.0
- USB port 1-2: Type A connector (front panel)
- USB port 3: Expansion interface option (CCA-LAMBADA mezzanine companion board)
- USB port 4-5: J4/P4 Rear I/O option (CDY-RIO rear I/O transition module)
- USB port 6: dedicated to the optional on-board USB Flash drive
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Ethernet
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- 3 x 10/100/1000Mbps Gigabit Ethernet controllers (82541)
- Jumbo Frame support up to 16KB
- 1 x 10/100Mbps Fast Ethernet Controller (82562)
- 1 x Gigabit and Fast Ethernet accessible via RJ45 jacks from the front panel
- 2 x Gigabit Ethernet as rear I/O according to PICMG® 2.16 across J3
(alternatively accessible via RJ45 jacks from the CDY-RIO back panel)
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IDE/ATA (Parallel)
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- Ultra ATA/100 connector (Secondary IDE), handover to CCA-LAMBADA mezzanine
expansion board with CCA on-board hard disk drive or external device
- CompactFlash socket (mezzanine module) for CFA ATA cards (Secondary IDE)
- J4/P4 Rear I/O option: Primary IDE accessible from CDY-RIO rear I/O transition module
- CD2 on-Board hard disk drive module option (Primary IDE)
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Serial ATA
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On-board dual Serial ATA controller, ports available across J5/P5 on CDY-RIO rear I/O module
(alternatively accessible via Serial ATA connectors on board), RAID and non-RAID
drivers available
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FLASH Drive
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Optional on-board USB2.0 FLASH drive controller and 2 pcs. NAND FLASH up to
8Gbit each (total memory capacity up to 2GByte), can be configured as bootable
disk, data transfer rates up to 18MB/s for read, 13MB/s for write (dual channel mode)
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Mezzanine Facility
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Optional usage of either
- 1 Slot for a PMC module, I/O from the front panel and across J5
- On-board 2.5-inch hard disk module (Primary IDE)
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Expansion Interface
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- On-board LPC/USB/AC97 Super-I/O, USB and audio expansion interface connector
- Suitable CCA-LAMBADA 3U mezzanine companion board available
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Rear I/O
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- 2 x Gigabit Ethernet (J3)
- 2 x Serial ATA (J3)
- Primary IDE (J4)
- 2 x USB (J4)
- LPT, COM, GPIO (J4)
- PMC mezzanine rear I/O (J5)
- Suitable rear I/O transition module CDY-RIO available
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CompactPCI Bus
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32-bit PCI bridge chip PLX PCI 6150 (HB4), 133MBps CPCI master, transparent mode
(CPCI system slot operation). When using the CD2-BEBOP on a peripheral slot the
PCI bridge must be removed (special board versions available on request)
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Hot Swap Function
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Board hot insertion/extraction without adversely effecting a running system,
'Basic Hot Swap' implementation according to CompactPCI Hot Swap Specification
PICMG® 2.1. In order to use the CD2-BEBOP as a peripheral slot board, the local
PCI bridge must be removed (stand-alone operation or
PICMG 2.16 communications path required instead of
PCI bus data exchange), special board versions are available on request
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PICMG® 2.16
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Dual Link Port Node, complies with the PICMG® 2.16 CompactPCI® Packet Switching Backplane Specification
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BIOS
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Phoenix BIOS
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Typical Power Consumption
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- +5V +0.25V/-0.15V tbd A max.
- +3.3V +0.17V/-0.1V tbd A max.
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Thermal Conditions
Environmental Conditions
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- Operating temperature: 0°C ... +70°C (CPU dependent)
- Storage temperature: -40°C ... +85°C, max. gradient 5°C/min
- Humidity 5% ... 95% RH non condensing
- Altitude -300m ... +3000m
- Shock 15g 0.33ms, 6g 6ms
- Vibration 1g 5-2000Hz
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EC Regulations
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EN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)
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Typical Performance Rating
(PCMark2002 under Windows XP
with 512MB PC2700 DDR)
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Board
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Processor
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CPU/MEM Score
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CD2-1X-BEBOP
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1.4GHz LV Pentium® M (Dothan 738)
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4745/8489
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CD2-2X-BEBOP
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1.8GHz Pentium® M (Dothan 745)
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6100/10441
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CD2-3X-BEBOP
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2.0GHz Pentium® M (Dothan 755)
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6773/11398
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MTBF
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tbd h
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